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3DSUG NEWS
3DSUG News: For Users, By Users March/2008
Hilton 
Word from the Chair 
Attend the vendor fair on Sunday evening to see the latest tools and equipment available to support your company's operations.
Sheku Kamara

The conference is less than one month away. The Conference Agenda is now finalized with distinguished presenters awaiting your audience. On Monday, instructors from RapidTech's NSF Center located at Saddleback College will conduct the first of two training session on hands-on finishing techniques. This session is followed by hands-on silicone molding training organized by Innovative Polymers and Jon Boomgarden. On Tuesday morning, I encourage you to bring along your best wishes and issues you'd like implemented by the manufacturers from a materials, hardware, software and maintenance standpoint. On Wednesday afternoon, the DSM SOMOS and Huntsman sponsored materials technical session will allow users to meet with the sales and technical members of both companies in person to discuss the latest in SLA materials available in the market. On Thursday, I urge you to bring a part along and experience 3D scanning and inspection using Capture 3D's scanners and expert technicians.

As in the past years, one of the many strengths of our conference is the networking opportunities it presents to users, operators, managers and owners within the industry. Bring along your business cards to share with others. As you know, you can have the right equipment but without the proper training you cannot always utilize it to the fullest. As our industry continues to mature, it is our responsibility to continue pushing the limits of the technology to benefit our companies. So please join us at this great event.
 
Once again I look forward to meeting with you all at the 2008 3DSUG conference. Remember, the 3DSUG is For Users, By Users. 

Sheku Kamara, 3DSUG Chairperson
E: chairperson@3dsug.org
O: 414/277-7189
C: 414/333-9421
Technical Competition
Don't underestimate the quality of your work, let the judges decide!
Bob ZubrickieYou only have a few more weeks to enter the 3DSUG Technical Competition, so gather your entry and present it! Fill out the Technical Competition Form and return it to me immediately. Normally we get a half dozen participants; however this year, there seems to be a shortage of applicants -- those who enter just may get an award for simply participating. I don't know if people feel intimidated by the intense competition of the past or what, but this is a great opportunity to showcase your work with fellow attendees. You may underestimate your hard work and it may be a winner in the judges eyes!
 
Winners will receive free admission to the SME Rapid 2008 conference in Orlando, Florida!

Don't forget this year in addition to the award, the winners will also receive free admission to the SME Rapid show in Orlando, Florida in May. This is a special offer from your 2008 3DSUG Chairperson to you. Take advantage of this offer and increase your chances of joining the SLA and SLS dinosaur hall of fame!
Support Your Sponsors
Look to the Users Group when sourcing new products or services.
When I need to outsource or when I need new products or services where do I go? The 3DSUG home page. Support the sponsors who support the 3DS Users Group. These sponsors are the experts in the field. I know when I use any of these sponsors I will get top notch help with my needs. You can do the same and help out your Users Group. Be sure to take the time and visit your 3DSUG home page and check out your new 2008 Sponsors. The 3DSUG is For Users, By Users and we could not do it without all these sponsors.
 
Bob Zubrickie, 2007 3DSUG Chair and Competition Coordinator
E: bobz@tycoelectronics.com
O: 717/592-5208
The Sorovetz Report
In the home stretch before zero hour!

Tom Sorovetz


Well folks, we are in the home stretch before zero hour. The conference agenda is complete and we have many exceptional presentations and hands-on training courses again this year.The 3DSUG is the ONLY global Selective Laser Sintering and Stereolithography conference that is ran by the users for the users. I know that travel budgets are extremely tight this year because of the poor economy; however, with the current agenda and hands-on training we (the Executive Board) are hoping that those who have not participated over the last few years will make it a high priority to attend.

The Tuesday night Technical Competition Awards Banquet is also complete. As always, this dress casual affair can be inside, outside or both. Please make sure you dress for the proper weather conditions.It is easy to take your jacket off if you are wearing one but difficult to put one on if you do not have it. Please remember that your 3DSUG Badge is required to board the bus and participate at the final destination. 
 
Once again, if you are flying into John Wayne (SNA) Airport the Hilton Orange County/Costa Mesa has a FREE shuttle to and from the airport. When you pick-up your baggage on the lower level there is a courtesy phone, use it to call the hotel and they will instruct you on where to pick-up the shuttle.
 
If you have not reserved your hotel room, please do so immediately to receive the $125.00 per night rate. And, if you would like to golf but have not signed up for the Saturday morning golf event yet please call Bob Dzugan or Signup Online.
 
See you in April in Costa Mesa.

Thomas Sorovetz, Site Coordinator
Accommodations & Travel 
Looking for the fastest way to get to the Orange County Hilton Costa Mesa? Try one of these: 
About 3DSUG
3DSUG was established to encourage and coordinate technical information exchange between owners and operators of 3D Systems equipment and provide feedback to 3D Systems on hardware and software modifications. The 3DSUG will meet annually to provide a forum for presentation of papers relating to the dissemination of processes and new technologies related to the operation of 3D Systems equipment and the secondary or final application of parts or/and tools made from these systems. For more information, visit: www.3dsug.org.
In This Issue
A Word from the Chair
Enter the Technical Competition
The Sorovetz Report
Travel & Accommodations
Quick Links
Join Mailing List
A VERY SPECIAL THANKS TO OUR SPONSORS!
 
Diamond Sponsors
 
3DSUG Conference Sponsor Huntsman
 
3DSUG Conference Sponsor DSM Somos 
 
Platinum Sponsors
NCP Leasing
 
Gold Sponsors
Curbell Plastics
Integra Services International
National RP Support
RapidTech
Solid Concepts
Spectrum 3D
 
Silver Sponsors
3D Systems
AIN Plastics
Applied Rapid Technologies
Creaform
Laser Reproductions
Materialise
Met-L-Flo
Paramount Industries
Valspar
 
Bronze Sponsors
Acu-Cast Technologies
BJB Enterprises
Bolt's Engraving
BUYCastings.com
Cadmium CD
Clemco Industries
DPSS Lasers
DSM Somos
Fineline Prototyping
Innovative Polymers
Invest Cast
Prototype Production
Ramco Equipment
Rapid Product Development Group
Rapid Sheet Metal, Inc.
RePliForm
Saddleback College
VacuCoat
 
Media Sponsors
Design World
TCT Magazine
Angerman Communications Group
 
 
Executive Committee

Sheku Kamara
Chairperson
Milwaukee School of Engineering

Brian Bauman
Vice Chairperson
DSM Somos

Luis Folgar
Vice Chairperson
Paramount Industries, Inc.

Guy Bourdeau
Treasurer
Huntsman Advanced Materials

Brad Palumbo
Secretary
Phoenix Analysis & Design

Tom Sorovetz
Site Coordinator
Chrysler LLC

Bob Zubrickie
Past Chairperson
Tyco Electronics


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