3DSUG Users Group Conference
3D Systems Users Group October 2008 
Conference Highlights
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Vendor Fair
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DSM Somos
 
 
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Call for Papers

Dear Nadra,

It's time to start thinking about presentations. This is our official call for papers! Last month, I introduced our preliminary agenda and hope you found it interesting with great content. Now it's time for you to help present at your conference. If you would like to present a technical paper, introduce a new application of our technologies or provide some hands--on training (based on the agenda), please email me with your name, presentation title and abstract for review. We need everyone's help -especially if you have improvements and best practices that would benefit others.

Additionally, I am pleased to announce that Dr. Paul Jacobs will be the keynote speaker at the 2009 Conference kickoff.  For those who know Dr. Paul Jacobs, realize the integral role he played at 3D Systems (as Director of R&D) in the birth of a new technology known today as Stereolithography. Dr. Paul Jacobs' presentations are always educational and inspiring.

I hope everyone can make it to the 2009 3DSUG to hear Dr. Paul Jacobs' keynote speech and for the new users to meet him as well as the dinosaurs of the group to reminisce of old times.

Brian Bauman, DSM Somos & 2009 3DSUG Chairperson 
E: chairperson@3dsug.org     


2009 3DSUG Conference Deadlines
  • NOW - Call for Papers
  • NOW - Early Registration for Attendees and Vendors
    NOV 1, 2008 - Preliminary Program
  • DEC 31, 2008 - Abstract Submissions
  • FEB 8, 2009 - Paper Submission Deadline
  • FEB 21, 2009 - Early Attendee Registration Cut Off Date 
    • $495/Attendee Before February 21, 2009
    • $600/Attendee After February 21, 2009
  • FEB 21, 2009 - Early Vendor Registration Cut Off Date 
    • $600/Table Before Februay 21, 2009
    • $700/Table After February 21, 2009
  • FEB 21, 2009 - Refund Cut Off Date
Vendor Fair: March 15th & 16th 2009 (6-10pm)

Solid Concepts

Acucast

 Rapid Product Development Group

Photos from top to bottom: Solid Concepts, Acucast and RPDG exhibits at the 2008 3DSUG Vendor Fair in Costa Mesa, California.

PRESENTATIONS

  • Emerging Technology
  • Rapid Manufacturing
  • 3D Systems Report
  • Sterolithography (SL) Material Vendor Panel
  • Laser Sintering (LS) Material Vendor Panel
  • SLA Viper Pro Round Table
  • Sinterstation Pro Round Table
  • Safety, Health and Environment: Practicing Responsibility
  • Unique Uses of RP Technology
  • 3D Scanning
  • Statistical Process Control
  • Lean Six Sigma
  • Test Methods
  • Are You Marketing? Learn Low!
HANDS-ON ACCREDITED TRAINING SESSIONS

 Part Finishing - Hand On Training

  • Finishing RP Parts (Certificate of Completion)
  • Silicone Molding (Certificate of Completion)
  • Basic Self Service for SLA Systems
  • Lightyear Software Training
  • Build Setup Software
  • Competitive Technology Applications
  • 3D Scanning & Metrology Techniques 
  • 3rd Party Software Training
  • And More!!!

Photo: 3DSUG members participate in hand-on training presented by RapidTech and Saddleback College.

THANK YOU 3DSUG SPONSORS
 Sponsorship Levels
  • $1,000 - Website recognition
  • $2,500 - Banner and website recognition
  • $5,000 - Banner, website recognition; One complimentaryexhibition space for the two-night vendor fair
  • $10,000 - Banner, website recognition; One complimentary exhibition space; plus one complimentary pass to the Awards Banquet
  • $15,000 - Banner, website recognition; One demo suite for
    three days; two complimentary exhibition spaces;
    one pass to the Awards Banquet
Thank you 2008 3DSUG Sponsors! If you would like to sponsor the 3DSUG annual conference, please let us know!
3DSUG
3DSUG Mission
3DSUG was established to encourage and coordinate technical information exchange between owners and operators of 3D Systems equipment and provide feedback to 3D Systems on hardware and software modifications. The 3DSUG will meet annually to provide a forum for presentation of papers relating to the dissemination of processes and new technologies related to the operation of 3D Systems equipment and the secondary or final application of parts or/and tools made from these systems.  
Special Notice: 3DSUG Annual Conference Registration Fees Increase After February 21, 2009 (With Exception to Meals and Awards Banquet). NO REFUND POLICY Effective.

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